The MOC activity draws on the expertise of all TRONICO's departments

Maintaining electronic boards in operational condition

Thanks to the meticulous selection of our suppliers, the long-term storage of components and traceability, our engineers can also propose solutions, including the partial or total redesign of your complex electronic assemblies, including hardware and software. And, of course, some of our operators are specially assigned to maintenance in operational conditions (MOC) or repairs.

Description

The business of maintaining electronic boards in operational condition capitalises on a number of skills:

Reverse engineering

  • Creating or upgrading definition files from a product
  • Create or upgrade Gerber files from a circuit
  • Printed, up to 10 layers
  • Identical placement / routing

Redesign

  • Implementing replacement solutions to deal with obsolescence
  • Local rerouting
  • Adaptations and updates to on-board software

Repairs

  • Troubleshooting on test benches or with procedures
  • Replacement of all electronic components
  • Wiring repairs (backplane, etc.)
  • Work on equipment manufactured by TRONICO or not
  • Product qualification before re-delivery
  • On electronic boards or assemblies
  • Racks, drawers, desks…

Obsolescence management

  • Monitoring and assessing the durability of nomenclatures / component bases
  • Monitoring of PCNs, ECNs and EOLs
  • Revalidation at each component life transition
  • Determination of drifts
  • Chip batch validation
  • Validation of re-encapsulated parts…

All these actions are carried out in consultation with the customer:

  • Proposal for replacement,
  • Re-encapsulation of chips,
  • Pinout adaptation,
  • Local rerouting, mezzanine cards, etc.

Other types of intervention are also possible on request, such as :

  • establishing an MCO contract (repair + upgrades + retrofit) for avionics assemblies
  • carry out work on customer sites
  • directly repair airborne equipment for PART145-certified companies

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TRONICO's global offer

Benefits

Reverse engineering

If a file is lost or a company closes, for example, the files no longer exist. TRONICO offers a range of services to deal with this problem:

  • Copying products identically by regenerating the files
  • Possibility of reverse engineering multi-layer boards. Experience: up to 10 layers on a 450 x 300 mm board
  • Possibility of integrating enhancements

Processing obsolescence

TRONICO subscribes to a database called PROMIERE, which enables us to monitor nomenclatures, anticipate obsolescence notices and propose replacement solutions. We deal with obsolescence at several levels:

  • 1st level: component sourcing at brokers with entry testing at TRONICO (in-house technology laboratory)
  • 2nd level: search for equivalence in the functions used, with validation by the technology laboratory
  • 3rd level: design of a daughter board incorporating the functions of the obsolete component
  • 4th level: redesign of part of the product to replace an obsolete function with no equivalent
  • 5th level: complete re-design of the product, retaining its external interfaces and functions. Generally, this study includes corrections to functionality and initial design.

Secure storage

After estimating the quantities to be supplied up to the end of the product’s life, we manufacture the assembly and store it in our “bunker”. Individual products are available within 48 hours. We guarantee the storage of strategic components over a long period of time in our “bunker”, which is protected against fire, intrusion, flooding, oxidation, etc.

Resources

Own resources

  • Methods: dedicated MCO agents, agents dedicated to repairs
  • Purchasing: MCO buyers within the Purchasing Department
  • Manufacturing: multi-skilled cabling operators
  • Test: operational test technicians
  • Time slots allocated for equipment: Takaya, In-situ, Synor, functional benches, CMS fitting, varnishing, etc.
  • Reporting: MCO and repairs assistants

Technical resources

  • Instrumentation controlled by CVI-LABWINDOWS
  • TEMPTRONIC heating systems
  • High-pressure chambers
  • Optical inspection
  • Pull test
  • Vibration
  • VRT
  • Damp heat
  • Thermal shock
  • X-ray inspection
  • Thermal cycle ovens ( -50°c +200°c)
  • Electronic CAD: Cadence V14.0, CadstarV4
  • Mechanical CAD: Autocad 2002
  • TERADYNE J750k

Technology available from TRONICO

  • Mixed 128 pin electronic tester (Memory Test Option, Mixed Signal Option, Analog Pin Measure Unit)
    • Logics
    • FPGA
    • ASIC
    • DSP, µ Proc
    • Memories
    • Dac, ADC, Codecs
    • Analog ( ampli-op, PWM….)
    • Applicable to an electronic sub-assembly
    • Temperature: -50°c, +200°c
    • Pressure: up to 2000 bar